DESCRIPTION:
This tape consisting of a PET Release liner with polyimide film and silicone adhesive designed for die-cut high temperature masking dises(Dots), Used for protection of printed circuit board during wave soldering, It is used in electrical insulation applications meeting class H requirements.
MAIN PRODUCT FEATURES:
Wide operating temperature range up to 500°F
Excellent electrical insulation
Removes cleanly without adhesive residue after exposure to heat /chemical.
APPLICATION IDEAS:
Used for die-cut polyimide dises(dots)
| TECHNICAL DATA | VALUE (ZH-PI260F ) |
| Color | Amber |
| Adhesion Type | Silicone |
| Film Thickness (mils/mm) | 1/0.025 |
| Adhesive Thickness(mils/mm) | 1.5/0.035 |
| Fluorosilicone release liner (mils/mm) | 3/0.075 |
| Adhesion to Steel: N/25mm | 6 |
| Tensile Strength (N/25mm) | 115 |
| Dielectric Strength, volts | 6500 |
| Temperature Resistance | 260°C (500°F) |
| Insulation Class, centigrade | H 180° |
| Elongation: % | 50 |
Tape Size: 3" plastic core , 33m length, from 2mm width upward
Special thickness or combinations can be supplied according to customer.
Products can be supplied in roll, tape according to customer requests.